PCB solder residue height measurement
In the PCB rework process, measurements need to be made on the solder residue. Through the spectral confocal sensor, the height of the solder at the PCB rework position is measured and, through tolerance control, it is possible to determine in real time whether the rework requirements have been met. It is also possible to measure the warpage and flatness of the PCB in real time.
PCB board real time 3D morphology effect
Cross-sectional profile analysis
Height numerical analysis